Silicon pad with duplex recess structure for key pad assembly

专利摘要:
PURPOSE: A silicon pad of a keypad assembly with a double-recess structure is provided to improve the softness by sufficiently removing a silicon located on a portion that operates directly according to a key manipulation. CONSTITUTION: A supporting unit(311) is protruded from an upper surface(310) of a silicon pad(300) and supports the center portion of a 4-way key. A switch protrusion(315) is provided at a location around the supporting unit(311), the location corresponding to a pushed portion of a switch provided on a PCB(Printed Circuit Board). A tension recess(331) for promoting a pushing operation of the switch protrusion(315) is formed on a lower surface of the silicon pad(300). A contact protrusion(330) protruded from the tension recess(331) and a supporting recess(341) for easing movement of the 4-way key are provided on the lower surface of the silicon pad(300).
公开号:KR20030044089A
申请号:KR1020010074438
申请日:2001-11-28
公开日:2003-06-09
发明作者:이기정
申请人:삼성전자주식회사；
IPC主号:

专利说明:

Silicon pad in keypad assembly with double groove structure {SILICON PAD WITH DUPLEX RECESS STRUCTURE FOR KEY PAD ASSEMBLY}
[16] The present invention relates to a keypad of the present invention, and more particularly, to a silicon pad constituting a keypad assembly.
[17] Various electronic products such as communication devices such as mobile phones and home appliances have switch devices for product operation and signal generation.In general, among the switch devices, the data input device is configured in the form of a keypad that protrudes through the hole in the front case of the product. do.
[18] A keypad assembly applied to such electronics is shown in FIG. 1.
[19] 1 is an exploded perspective view illustrating a keypad assembly 100 including a general 4-way key, FIG. 2 is a partially cutaway perspective view illustrating a silicon pad 200 of a keypad assembly according to a conventional embodiment, and FIG. 2 is a cross-sectional view illustrating a state in which the silicon pad 200 illustrated in FIG. 2 is coupled to a keypad assembly. The keypad assembly shown in FIGS. 1-3 is an example of a four-way key in a seesaw manner.
[20] As shown in FIGS. 1 to 3, the keypad assembly 100 including the 4-way key 120 includes a 4-way key 120 protruding through the hole 111 of the front case 110. , Silicon pad 200, and PCB (PCB) 140.
[21] The four-way key 120 is a shape in which four semicircular keys face each other in pairs in four directions, and the two keys facing each other face the inside of the front case 110 so as not to be pressed at the same time. On the surface to form a projection 121 in the center is moved like a sisio. In addition, another projection 123 is formed on the surface of the semi-circular key facing the inside of the front case 110 so that the switch 141 installed on the PC 140 may be pressed. In this case, it is the silicon pad 200 to directly contact and press the switch 141 installed on the PC 140, and specifically, the protrusion 230 formed on the silicon pad 200. The lower end 125 of the 4-way key 120 is supported on the inner wall of the groove 111 of the front case 110, and the upper surface 127 protrudes through the groove 111 of the front case 110. It is installed to be easy for the user to operate.
[22] The protrusions 211 and 213 are formed on the top surface 210 of the silicon pad 200 to correspond to the protrusions 121 and 123 formed on the central and semi-circular keys formed on the 4-way key 120. The center supporting protrusion 121 is supported, and the switch 141 on the PC 140 is operated in accordance with the operation of the semi-circular key. In order to operate the switch 141, the silicon pad 200 forms a contact protrusion 230 on the bottom surface 220 facing the PC 140, and the contact protrusion 230 is formed on the PC 140. A predetermined groove 231 is formed around the contact protrusion 230 so as not to affect other parts other than the switch 141, and the support protrusion 211 for supporting the central protrusion 121 is also formed at the position where the support protrusion 211 is formed. The groove 237 is formed on the bottom surface 220 of the silicon pad 200 similarly to the periphery of the contact protrusion 230.
[23] The PC 140 may use a flexible circuit (FPC), which is advantageous for miniaturization of a product, and the switch 141 installed on the PC 140 may have two contacts and a metal dome connecting the contacts. A metal dome switch provided with a dome) on the contacts or a carbon contact switch having a carbon contact attached to a contact protrusion of the silicon pad without using the metal dome is mainly used.
[24] However, since the silicon pad of the keypad assembly having the above configuration is not manufactured to have a sufficient depth and shape in the groove formed around the contact protrusion, the user feels that the key is not clicked when the key is pressed, and furthermore, the protrusion of the silicon pad in the center of the key The grooves formed at the support projection positions on the silicon pads supporting the do not also have a sufficient depth and shape, so that the support projections unnecessarily push the 4-way key with a large force. This is a problem that the four-way key is too close to the front case groove, the key operability is reduced when the key is clicked.
[25] In order to solve the above problems, an object of the present invention is to provide a silicon pad of the keypad assembly to prevent the operation of the key is lowered, giving a natural feeling of key operation.
[26] In order to achieve the above object, the present invention is installed on the PC according to the operation of the key and the key configured to rotate the predetermined support means formed in the center by a predetermined angle to press the switch in two or more directions A silicon pad for operating a switch, wherein the silicon pad faces the PCB and includes a first bottom formed at each position corresponding to the switch on the PC, and a depth deeper than the first bottom on the first bottom. A tension groove having a second bottom formed in a recess at least two times; A silicon pad of a keypad assembly having a double groove structure, each of which protrudes from the second bottom surface and includes contact protrusions for pressing the switch according to manipulation of the key.
[1] 1 is an exploded perspective view illustrating a keypad assembly including a general 4-way key;
[2] 2 is a partially cutaway perspective view illustrating a silicon pad of a keypad assembly according to an exemplary embodiment of the present disclosure;
[3] 3 is a cross-sectional view illustrating a state in which the silicon pad illustrated in FIG. 2 is coupled to a keypad assembly;
[4] 4A is a partially cut away perspective view illustrating a silicon pad of a keypad assembly having a double groove structure according to a preferred embodiment of the present invention;
[5] 4B is an enlarged view of A illustrated in FIG. 4A;
[6] 4C is an enlarged view of B illustrated in FIG. 4A;
[7] FIG. 5 is a cross-sectional view illustrating a state in which the silicon pad illustrated in FIG. 4 is coupled to a keypad assembly. FIG.
[8] Description of the main parts of the drawing
[9] 300: silicon pad 310: silicon pad upper surface
[10] 311: support portion 315: switch protrusion
[11] 320: silicon pad lower surface 330: contact projection
[12] 331: tension groove 333: the first bottom
[13] 335: 2nd bottom 341: Supporting part groove
[14] 343: first support part groove 345: second support part groove
[15] 350: connecting groove
[27] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, detailed descriptions of related well-known functions or configurations are omitted in order not to obscure the subject matter of the present invention.
[28] 4A is a partially cutaway perspective view illustrating a silicon pad 300 of a keypad assembly having a double groove structure according to a preferred embodiment of the present invention, FIG. 4B is an enlarged view of A shown in FIG. 4A, and FIG. 4C is 4A is an enlarged view illustrating B illustrated in FIG. 4A, and FIG. 5 is a cross-sectional view illustrating a state in which the silicon pad 300 illustrated in FIG. 4 is coupled to a keypad assembly.
[29] The silicon pad 300 shown in FIGS. 4A, 4B, 4C, and 5 is an example applied to the four-way key 420. As shown in Figures 4a, 4b, 4c and 5, the silicon pad 300 of the keypad assembly according to a preferred embodiment of the present invention is a groove (331, 341) having a step and protruding into the groove The contact protrusion 330 is included.
[30] A support part 311 protrudes from the upper surface 310 of the silicon pad 300 to support the center of the 4-way key 420, and the 4-way key 420 is moved around the support part 311. When operating, the switch protrusion 315 is provided at a position corresponding to the portion where the switch 441 installed on the PC 440 is pressed. A lower surface of the silicon pad 300 of the switch protrusions 315 is provided. The tension groove 331 is formed to facilitate the pressing operation, and the contact protrusion 330 protruding from the tension groove 331 and the four-way key 420 in order to naturally move the pressing operation. The support groove 341 is also provided at a position corresponding to the support 311.
[31] The support part 311 supports the center of the 4-way key 420, so that the switch 441 on the PC 440 is not pressed when the 4-way key 420 is not pressed. Lifting both ends 425 of 420. Accordingly, the contact protrusion 330 of the silicon pad 300 is spaced apart from the switch 441 on the PCB 440 by a predetermined interval without pressing the 4-way key 420. According to an embodiment, a predetermined support protrusion 421 may be formed on the four-way key 420, and a seating portion 312 to which the support protrusion 421 is coupled may be formed on an upper end of the support portion 311. .
[32] The support part grooves 341 formed on the bottom surface 320 of the silicon pad 300 to correspond to the support part 311 are used to smoothly move the support part 311. The first support groove 343 recessed to a predetermined diameter at 320 and the second support groove 345 recessed to a diameter smaller than the first support groove 343 at the bottom of the first support groove 343. By forming a dual structure having a step, and may additionally form a projection 347 to reinforce the central axis of the 4-way key 420 in the center of the support portion groove 341. By forming the support part grooves 341 having the dual structure, the support part 311 of the silicon pad 300 is improved in flexibility, and the feeling of operating the four-way key 420 becomes natural.
[33] The switch protrusion 315 protrudes from the upper surface 310 of the silicon pad 300, and is formed at a position corresponding to the switch 441 installed in the PC 440. The upper end of the switch protrusion 315 is in contact with the inner edge of the four-way key 420 is moved in accordance with the operation of the four-way key 420.
[34] The contact protrusion groove 331 formed on the bottom surface of the silicon pad 300 is installed at the same point as the switch protrusion 315, and the support groove 341 smoothly moves the support portion 311. Similarly, the tension groove 331 serves to facilitate the movement of the switch protrusion 315. The tension groove 331 is formed on the lower surface 320 of the silicon pad 300 with a predetermined diameter than the diameter of the first bottom surface 333 and the first bottom surface 333 on the first bottom surface 333. The second bottom surface 335 is small. The tension groove 331 of the dual structure as described above makes the movement of the switch protrusion 315 more flexible, so that the switch is clicked more naturally when the 4-way key 420 is pressed.
[35] The contact protrusion 330 protrudes from the second bottom surface 335 of the tension groove 331 so that the end thereof is spaced apart from the switch 441 on the PCB 440 at a predetermined interval, and the 4-way By operating the key 420, the switch 441 is pressed.
[36] In addition, the tension grooves 331 are connected to the support groove 341 through predetermined connection grooves 350, respectively. By forming a connection groove 350 between the tension groove 331 and the support groove 341, when a specific key of the 4-way key is operated, the flexibility of the silicon pad is insufficient to prevent interference from pressing to other switches. can do. In addition, the PCB 440 may pursue miniaturization of a product by using a flexible circuit, and a switch having a metal dome structure is generally used as the switch 441, and a carbon contact type switch may be used according to an embodiment. Can be.
[37] As a result, the present invention provides a groove in which the silicon pad sufficiently removes unnecessary silicon remaining in the silicon pad for application to a key configured to move a single key like a seesaw to operate two or more different switches. This improves the flexibility of the silicon pad, and in some embodiments may be applied to a silicon pad of a key that repeats only a single operation.
[38] On the other hand, the detailed description of the present invention has been described with respect to specific embodiments, it will be apparent to those of ordinary skill in the art that various modifications are possible without departing from the scope of the present invention.
[39] As described above, the silicon pad of the keypad assembly according to the present invention sufficiently removes unnecessary parts of silicon, particularly silicon of a part directly acting according to key manipulation, thereby improving the flexibility of the silicon pad. Therefore, when the user manipulates the key, the user can get a more natural feeling. Also, in the 4-way key method configured to perform two or more switch operations with a single key, the silicon pad is pressed when a specific key is pressed. By working more flexibly, you avoid the interference of other keys.

权利要求:
Claims (3)
[1" claim-type="Currently amended] In the silicon pad for operating a switch provided on the PCB in accordance with the operation of the key and the key configured to rotate the predetermined support means formed in the center by a predetermined angle to the axis in the two or more directions,
At least one surface of the silicon pad facing the PCB may include a first bottom which is formed at each position corresponding to the switch on the PC, and a second bottom which is formed in the first bottom deeper than the first bottom. A tension groove having two or more steps;
And a contact protrusion protruding from the second bottom surface to press the switch according to the manipulation of the key.
[2" claim-type="Currently amended] According to claim 1,
The silicon pad of the keypad assembly having a double groove structure, wherein the silicon pad further comprises a support groove formed in the same shape as the contact protrusion groove at a position where the support means is formed on a surface facing the PCB.
[3" claim-type="Currently amended] The method of claim 2,
And a connecting groove connecting each of the contact protrusion grooves and the support grooves on the silicon pad surface.

类似技术:

---

公开号 | 公开日 | 专利标题

---

US7502013B2|2009-03-10|Pointing device

---

US7999748B2|2011-08-16|Antennas for electronic devices

---

KR100871925B1|2008-12-05|Switching device

---

JP4302024B2|2009-07-22|Button structure, portable electronic device

---

US5841374A|1998-11-24|Micro word-pad with tactile multifunctional keys

---

JP3708508B2|2005-10-19|Fingertip tactile input device and portable information terminal using the same

---

US7544904B2|2009-06-09|Electronic apparatus

---

JP4446925B2|2010-04-07|Slide operation switch

---

US6180903B1|2001-01-30|Tact Switch

---

US5769210A|1998-06-23|Scissors-type key switch

---

US6717572B1|2004-04-06|Modular rolling axis apparatus

---

DE60317414T2|2008-09-18|Push button for mobile telecommunication device with vibration preventing device

---

US7094979B2|2006-08-22|Switching device and portable terminal device

---

US6396006B1|2002-05-28|Pressing and rotating operation type electronic parts and communication terminal equipment using the electronic parts

---

CN100473083C|2009-03-25|Key asembly

---

JP3752240B2|2006-03-08|key switch

---

CN101815977B|2012-07-11|Fingertip tactile-sense input device

---

DE10324295B4|2016-02-18|Electric switch

---

US7800008B2|2010-09-21|Side key assembly and electronic device using the same

---

US5917906A|1999-06-29|Touch pad with tactile feature

---

DE69915442T2|2005-01-13|Electronic rotary pressure switch component and electronic device for its use

---

US20020042853A1|2002-04-11|Electronic device provided with an input means

---

CN1932711B|2010-05-26|Multidirectional key

---

US9880648B2|2018-01-30|Touch pad input device

---

US20040240162A1|2004-12-02|Housing of electronic device with a side key assembly

同族专利:

---

公开号 | 公开日

---

引用文献:

---

公开号 | 申请日 | 公开日 | 申请人 | 专利标题

---

法律状态:
2001-11-28|Application filed by 삼성전자주식회사

---

2001-11-28|Priority to KR1020010074438A

---

2003-06-09|Publication of KR20030044089A

优先权:

---

申请号 | 申请日 | 专利标题

---

KR1020010074438A|KR20030044089A|2001-11-28|2001-11-28|Silicon pad with duplex recess structure for key pad assembly|